Stacking kit for M5300 series rear I/O bays

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Additional information


AX742 Stacking Kit is cost-effective preferred method for local Virtual Chassis Stacking using both rear I/O bays. When some switches are distant, affordable SFP+ (AX743) and 10GBase-T (AX745) I/O modules allow for fiber or copper distant connections, still leveraging rear bays zero-touch stacking functionality.

Features –

  • For deployment convenience, M5300 series two rear I/O bays are pre-configured for stacking mode in factory default settings, allows for zero-touch stacking as soon as back connectivity is detected.
  • Copper, fiber can be mixed and matched for stacking interconnect.
  • One AX742 Stacking Kit per M5300 switch for local, dual ring topology
  • Latest IEEE 802.3ak 10GBASE-CX4 specifications (infiniband)
  • Each I/O module half-duplex speed is 12 Gbps (24 Gbps full duplex) with 1m cable



  • AX742 is a bundle: 2 CX4 I/O modules AX744 + 1 stacking CX4 cable (1m – 3.3 ft)
  • Dual ring stacking interconnect is 48 Gbps per switch (384 Gbps per stack) when one AX742 kit per switch (two I/O modules)
  • Longer cable may be used (standard infiniband CX4 cable)